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1. product profile 1.1 general description npn general-purpose transistors in surf ace-mounted device (smd) plastic packages. [1] valid for all avail able selection groups. 1.2 features and benefits ? general-purpose transistors ? smd plastic packages ? three different gain selections 1.3 applications ? general-purpose switching and amplification bc847 series 45 v, 100 ma npn general-purpose transistors rev. 8 ? 20 august 2012 product data sheet table 1. product overview type number [1] package pnp complement nxp jeita jedec bc847 sot23 - to-236ab bc857 bc847a bc857a bc847b bc857b bc847c bc857c bc847w sot323 sc-70 - bc857w bc847aw bc857aw bc847bw bc857bw bc847cw bc857cw bc847t sot416 sc-75 - bc857t bc847at bc857at bc847bt bc857bt bc847ct bc857ct BC847AM sot883 sc-101 - bc857am bc847bm bc857bm bc847cm bc857cm
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 2 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 1.4 quick reference data 2. pinning information table 2. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - 45 v i c collector current - - 100 ma h fe dc current gain v ce =5v; i c =2ma 110 - 800 h fe group a 110 180 220 h fe group b 200 290 450 h fe group c 420 520 800 table 3. pinning pin description simplified outline graphic symbol sot23, sot3 23, sot416 1base 2emitter 3 collector sot883 1base 2emitter 3 collector 006aaa144 12 3 sym021 3 2 1 3 1 2 transparent top view sym021 3 2 1
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 3 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 3. ordering information [1] valid for all avail able selection groups. 4. marking [1] * = placeholder for manufacturing site code table 4. ordering information type number [1] package name description version bc847 - plastic surface-mounted package; 3 leads sot23 bc847a bc847b bc847c bc847w sc-70 plastic surface-mounted package; 3 leads sot323 bc847aw bc847bw bc847cw bc847t sc-75 plastic surface-mounted package; 3 leads sot416 bc847at bc847bt bc847ct BC847AM sc-101 leadless ultra small plastic package; 3 solder lands; body 1.0 ? 0.6 ? 0.5 mm sot883 bc847bm bc847cm table 5. marking codes type number marking code [1] type number marking code [1] bc847 1h* bc847t 1n bc847a 1e* bc847at 1e bc847b 1f* bc847bt 1f bc847c 1g* bc847ct 1g bc847w 1h* BC847AM d4 bc847aw 1e* bc847bm d5 bc847bw 1f* bc847cm d6 bc847cw 1g*
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 4 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb with 60 ? m copper strip line, standard footprint. 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb with 60 ? m copper strip line, standard footprint. table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cbo collector-base voltage open emitter - 50 v v ceo collector-emitter voltage open base - 45 v v ebo emitter-base voltage open collector - 6 v i c collector current - 100 ma i cm peak collector current single pulse; t p ? 1ms -200ma i bm peak base current single pulse; t p ? 1ms -100ma p tot total power dissipation t amb ? 25 ?c [1] sot23 - 250 mw sot323 - 200 mw sot416 - 150 mw sot883 [2] -250mw t j junction temperature - 150 ?c t amb ambient temperature ? 65 +150 ?c t stg storage temperature ? 65 +150 ?c table 7. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] sot23 - - 500 k/w sot323 - - 625 k/w sot416 - - 833 k/w sot883 [2] --500k/w
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 5 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 7. characteristics [1] pulse test: t p ? 300 ? s; ? = 0.02. [2] v be decreases by approximately 2 mv/ k with increasing temperature. table 8. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit i cbo collector-base cut-off current v cb =30v; i e =0a - - 15 na v cb =30v; i e =0a; t j = 150 ?c --5 ? a i ebo emitter-base cut-off current v eb =5v; i c = 0 a - - 100 na h fe dc current gain v ce =5v; i c =10 ? a h fe group a - 90 - h fe group b - 150 - h fe group c - 270 - dc current gain v ce =5v; i c =2ma 110 - 800 h fe group a 110 180 220 h fe group b 200 290 450 h fe group c 420 520 800 v cesat collector-emitter saturation voltage i c =10ma; i b =0.5ma - 90 200 mv i c =100ma; i b =5ma [1] - 200 400 mv v besat base-emitter saturation voltage i c =10ma; i b =0.5ma [2] - 700 - mv i c =100ma; i b =5ma [2] - 900 - mv v be base-emitter voltage i c =2ma; v ce =5v [2] 580 660 700 mv i c =10ma; v ce =5v - - 770 mv f t transition frequency v ce =5v; i c =10ma; f=100mhz 100--mhz c c collector capacitance v cb =10v; i e =i e =0a; f=1mhz --1.5pf c e emitter capacitance v eb =0.5v; i c =i c =0a; f=1mhz -11-pf nf noise figure i c =200 ? a; v ce =5v; r s =2k ? ; f = 1 khz; b=200hz -210db
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 6 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors v ce =5v (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c v ce =5v (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c fig 1. group a: dc current gain as a function of collector current; typical values fig 2. group a: base-emitter voltage as a function of collector current; typical values i c /i b =20 (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c i c /i b =10 (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c fig 3. group a: collector-emitter saturation voltage as a function of collector current; typical values fig 4. group a: base-emitter saturation voltage as a function of collector current; typical values mgt723 10 ?1 11010 2 10 3 i c (ma) 0 400 300 200 100 h fe (1) (2) (3) mgt724 10 ?1 11010 2 10 3 i c (ma) 0 1200 1000 800 600 400 200 v be (mv) (1) (2) (3) 10 3 10 2 10 mgt725 10 ?1 11010 2 10 3 i c (ma) v cesat (mv) (1) (2) (3) mgt726 10 ?1 11010 2 10 3 i c (ma) 0 1200 1000 800 600 400 200 v besat (mv) (1) (2) (3)
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 7 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors v ce =5v (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c v ce =5v (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c fig 5. group b: dc current gain as a function of collector current; typical values fig 6. group b: base-emitter voltage as a function of collector current; typical values i c /i b =20 (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c i c /i b =10 (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c fig 7. group b: collector-emitter saturation voltage as a function of collector current; typical values fig 8. group b: base-emitter saturation voltage as a function of collector current; typical values mgt727 10 ?1 11010 2 10 3 i c (ma) 0 600 500 400 300 200 100 h fe (1) (2) (3) 0 1200 1000 800 600 400 200 mgt728 10 ?2 10 ?1 11010 2 10 3 i c (ma) v be (mv) (1) (2) (3) 10 4 10 3 10 2 10 mgt729 10 ?1 11010 2 10 3 i c (ma) v cesat (mv) (1) (2) (3) mgt730 10 ?1 11010 2 10 3 i c (ma) 0 1200 1000 800 600 400 200 v besat (mv) (1) (2) (3)
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 8 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors v ce =5v (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c v ce =5v (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c fig 9. group c: dc current gain as a function of collector current; typical values fig 10. group c: base-emitter voltage as a function of collector current; typical values i c /i b =20 (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c i c /i b =10 (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c fig 11. group c: collector-emitter saturation voltage as a function of collector current; typical values fig 12. group c: base-emitter saturation voltage as a function of collector current; typical values mgt731 10 ?1 11010 2 10 3 i c (ma) 0 1200 1000 800 600 400 200 h fe (1) (2) (3) 0 1200 1000 800 600 400 200 mgt732 10 ?2 10 ?1 11010 2 10 3 i c (ma) v be (mv) (1) (2) (3) 10 4 10 3 10 2 10 mgt733 10 ?1 11010 2 10 3 i c (ma) v cesat (mv) (1) (2) (3) mgt734 10 ?1 11010 2 10 3 i c (ma) 0 1200 1000 800 600 400 200 v besat (mv) (1) (2) (3)
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 9 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 8. package outline fig 13. package outline sot23 (to-236ab) fig 14. package outline sot323 (sc-70) 04-11-04 dimensions in mm 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 12 3 04-11-04 dimensions in mm 0.45 0.15 1.1 0.8 2.2 1.8 2.2 2.0 1.35 1.15 1.3 0.4 0.3 0.25 0.10 12 3
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 10 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors fig 15. package outline sot416 (sc-75) fig 16. package outline sot883 (sc-101) 04-11-04 dimensions in mm 0.95 0.60 1.8 1.4 1.75 1.45 0.9 0.7 0.25 0.10 1 0.30 0.15 12 3 0.45 0.15 03-04-03 dimensions in mm 0.62 0.55 0.55 0.47 0.50 0.46 0.65 0.20 0.12 3 21 0.30 0.22 0.30 0.22 1.02 0.95 0.35
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 11 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 9. packing information [1] for further information and the avai lability of packing methods, see section 13 . [2] valid for all avail able selection groups. table 9. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number [2] package description packing quantity 3000 5000 10000 bc847 sot23 4 mm pitch, 8 mm tape and reel -215 - -235 bc847a bc847b bc847c bc847w sot323 4 mm pitch, 8 mm tape and reel -115 - -135 bc847aw bc847bw bc847cw bc847t sot416 4 mm pitch, 8 mm tape and reel -115 - -135 bc847at bc847bt bc847ct BC847AM sot883 2 mm pitch, 8 mm tape and reel - - -315 bc847bm bc847cm
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 12 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 10. soldering fig 17. reflow soldering footprint sot23 (to-236ab) fig 18. wave soldering footprint sot23 (to-236ab) solder lands solder resist occupied area solder paste sot023_fr 0.5 (3) 0.6 (3) 0.6 (3) 0.7 (3) 3 1 3.3 2.9 1.7 1.9 2 dimensions in mm solder lands solder resist occupied area preferred transport direction during soldering sot023_fw 2.8 4.5 1.4 4.6 1.4 (2) 1.2 (2) 2.2 2.6 dimensions in mm
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 13 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors fig 19. reflow soldering footprint sot323 (sc-70) fig 20. wave soldering footprint sot323 (sc-70) solder lands solder resist occupied area solder paste sot323_fr 2.65 2.35 0.6 (3) 0.5 (3) 0.55 (3) 1.325 1.85 1.3 3 2 1 dimensions in mm sot323_fw 3.65 2.1 1.425 (3) 4.6 09 (2) 2.575 1.8 solder lands solder resist occupied area preferred transport direction during soldering dimensions in mm
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 14 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors fig 21. reflow soldering footprint sot416 (sc-75) fig 22. reflow soldering footprint sot883 (sc-101) solder lands solder resist occupied area solder paste sot416_fr 0.85 1.7 2.2 2 0.5 (3) 0.6 (3) 1 1.3 dimensions in mm solder lands solder resist occupied area solder paste sot883_fr 1.3 0.3 0.6 0.7 0.4 0.9 0.3 (2) 0.4 (2) 0.25 (2) r0.05 (12) 0.7 dimensions in mm
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 15 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 11. revision history table 10. revision history document id release date data sheet status change notice supersedes bc847_ser v.8 20120820 product data sheet - bc847_bc547_ser v.7 modifications: ? type numbers removed: bc847b/dg, bc847bw/dg, bc847at/dg, bc857, bc857b and bc857c ? section 12 ? legal information ? : updated bc847_bc547_ser v.7 20081210 product data sheet - bc847_bc547_ser v.6 bc847_bc547_ser v.6 20050519 product data sheet - -
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 16 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
bc847_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 8 ? 20 august 2012 17 of 18 nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors bc847 series 45 v, 100 ma npn general-purpose transistors ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 20 august 2012 document identifier: bc847_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 packing information . . . . . . . . . . . . . . . . . . . . 11 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13 contact information. . . . . . . . . . . . . . . . . . . . . 17 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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